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excel first review and training center, inc. assignment 2 electronics engineeering
Typology: Assignments
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Instruction: Submit your answer sheet (provided) together with this questionnaire to the office for checking.
Time Element: 4 hours
A. have any value above zero B. never be positive * C. never be negative D. not be calculated
A. jumps from one orbit to another B. is raised to a higher orbit C. comes to the ground state D. is completely removed *
A. 32 C. 18 * B. 8 D. 50
A. 2, 10, 2 C. 2, 7, 5 B. 2, 8, 4 * D. 2, 4, 8
A. ionic C. mutual B. covalent * D. metallic
A. 6 C. 18 B. 8 * D. 2
A. partially filled B. half filled * C. completely occupied D. empty
A. conduction-band electrons * B. valence-band electrons C. holes in the valence band D. thermally-generated electrons
A. are lighter B. experience collision less frequently C. have negative charge
D. need less energy to move them *
A. decrease the number of charge carriers B. change the chemical properties of semiconductors C. make semiconductors less than 100 percent pure D. alter the crystal structures of the pure semiconductor *
A. drift B. recombination C. doping D. all of the above *
A. mixing C. diffusing B. doping * D. refining
A. germanium B. copper C. silicon * D. carbon
A. recombination B. ionization C. thermal energy * D. doping
A. an electron falls into a hole * B. a positive and a negative ion bond together C. a valence electron becomes a conduction D. a crystal is formed
A. mixing of current carries B. forward bias C. reverse bias D. barrier potential *
A. heat energy * B. barrier potential C. chemical energy D. majority carriers
A. solid-state * B. silicon C. germanium D. intrinsic
A. breakdown B. bias * C. barrier D. reverse
A. depletion * B. potential barrier C. saturation D. space charge
A. reverse biasing B. forward biasing C. crystal doping D. migration of mobile charge carriers *
A. decrease B. increase C. increase and decrease respectively D. decrease and increase respectively *
A. 3 x 10^12 m-3^ * B. 11 x 10^12 m- C. 7 x 10^12 m- D. 27 x 10^12 m-
A. 4. B. 3. C. 2.12 * D. 1.
A. 1.82 μA * B. 1.24 μA C. 2.13 μA D. 2.73 μA
A. must be greater than 0.3V B. must be greater than 0.7V * C. depends on the width of the depletion region D. depends on the concentration of majority carriers
A. blocks current B. conducts current * C. has a high resistance D. drops a large voltage
A. the ratio of majority carriers to minority carriers B. the amount of current across the P-N junction C. a dc voltage applied across the P-N junction to control its operation * D. none of the above
A. an external voltage is applied that is positive at the anode and negative at the cathode B. an external voltage is applied that is negative at the anode and positive at the cathode C. an external voltage is applied that is positive at the P-region and negative at the N-region D. A and C above *
A. the only current is the hole current B. the only current is the electron current C. the only currents produced by majority carriers D. the current is produced by both holes and electrons *
A. the applied voltage B. the temperature C. the current * D. the thermal voltage
A. VR- B. VR-1/ C. VR-1/3^ * D. VR1/
A. width of the depletion region B. mean life-term of holes C. mean life-term of electrons * D. junction area
A. decreases with light doping B. increases with heavy doping C. is independent of applied voltage D. is increased under reverse bias *
A. 0. B. 0. C. 0.9 * D. 0.
A. under high temperature condition B. with forward bias C. under reverse bias * D. because of manufacturing defect
A. collision * B. ionization C. doping D. recombination
A. 10 B. 6 * C. 2 D. 5
A. rectifier *
B. demodulator C. clamper D. chopper
A. suppress variations in signal voltage B. raise positive half-cycle of the signal C. lower negative half-cycle of the signal D. introduce a dc level into an ac signal *
A. Infrared radiation B. Blue C. Green D. Red or yellow (amber) *
A. is relatively cheap B. needs lower doping level C. has higher temperature and current capacity * D. has lower breakdown voltage
A. forward-biased B. connected in series C. troubled by overheating D. reverse-biased *
A. they have high energy B. barrier potential is very low C. depletion layer is extremely thin * D. impurity level is low
A. determining tunneling speed of electrons B. the design of an oscillator C. amplifier designing D. computer applications *
A. has variable capacitance B. utilizes transition capacitance of a junction C. has always a uniform doping profile * D. is often used as an automatic frequency control device
A. Schottky B. IMPATT *
B. photodiode C. LED D. phototransistor
A. control C. disconnect B. isolate * D. protect
A. high-voltage transients B. surge voltages C. low-level noise D. all of the above *
A. P-N junction is reverse-biased B. depletion region widens C. holes and electrons recombine * D. P-N junction becomes hot
A. recombination of charge carriers takes place * B. diode gets heated up C. light falling on the diode gets amplified D. light gets reflected due to lens action
A. ultraviolet region B. violet-blue green range of the visible region C. visible region D. infrared region *
A. alter leakage current B. change base voltage C. switch it ON * D. alter emitter current
A. has to dissipate maximum power * B. has to supply the charge carriers C. is the first region of the transistor D. must possess low resistance
A. collector + ve, base - ve B. collector – ve, base + ve C. collector – ve, base - ve D. collector + ve, base + ve *
A. recombine with holes in the base B. recombine in the emitter itself C. pass through the base to the collector * D. are stopped by the junction barrier
A. emitter with high level of impurity B. emitter with low level of impurity C. collector with high level of impurity D. collector with low level of impurity *
A. doubles for every 10oC rise in temperature * B. doubles for every 1oC rise in temperature C. increases linearly with the temperature D. doubles for every 5oC in temperature
A. positive and > 1 B. positive and < 1 C. negative and > 1 D. negative and <1 *
A. IC will decrease B. VCE will decrease C. VCE will increase D. IC will increase *
A. input resistance B. base current C. output resistance * D. voltage gain
A. shorted C. open B. saturated * D. cut-off
A. saturated * C. critical B. cut-off D. complemented
A. is zero and IC is zero B. is low and IC is high * C. equals VCC and IC is zero D. equals VCC and IC is high
A. equals VCC and IC is high B. equals VCC and IC is zero * C. is low and IC is high D. is high and IC is low
A. 0.1 to 1. B. 10.1 to 100 C. 1.01 to 10 * D. 100.1 to 1000
A. in the emitter * B. in the base C. through CB junction D. in the collector
A. IC only B. both IC and IE * C. IE only D. leakage current
A. VCE = 0 B. VCE = VCC * C. VCE has negative value D. IC is maximum
A. IC = 0 B. IB controls IC C. VCE = 0 * D. VCE has positive value
A. storage time * C. turn-off time B. turn-on time D. delay time
A. avalanche breakdown B. thermal breakdown C. base narrowing * D. zener breakdown
A. 20 kHz C. 25 kHz * B. 50 kHz D. 30 kHz