1. Chemical Vapour Deposition (CVD)
Chemical vapour deposition (CVD) is a well-known technology in the field of
nonmanufacturing. It is often used in large-scale integrated circuits, insulating materials,
magnetic materials, and optoelectronic materials. Chemical vapour deposition (CVD) and
Physical vapour deposition (PVD) are two different processes used to deposit thin films of
material onto a substrate. Both CVD and PVD are widely used in the semiconductor industry
and other fields to produce thin films for a variety of applications.
Chemical vapour deposition (CVD) can deposit evaporated reactants on the surface to form
thin films. For example, graphene is the most widely recognized product of CVD. So, what is
the principle of CVD?
Principle of Chemical Vapour Deposition (CVD)
CVD has been studied since the end of the 19th century. It is mainly used in the synthesis and
preparation of important materials. If we want to know how CVD makes a specific film, we
must first understand its principle.
CVD belongs to the "bottom-up" technology. Its principle is to introduce the vapour of gaseous
or liquid reactants containing film elements and other gases needed to react into the reaction
chamber. By increasing the temperature, plasma action, light radiation, or other forms of
energy, CVD can produce chemical reactions on the substrate surface and generate new solid
substances to be deposited on the surface.
Dr. P. Venkata Ramana, AUCE(A)
